Semiconductor package and semiconductor package mounting method

ABSTRACT

To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor package and asemiconductor package mounting method. In particular, the inventionrelates to a semiconductor package for which it is easy to verify theorientation when mounting the semiconductor package onto a substrate anda semiconductor package mounting method.

2. Description of Related Art

Conventionally, mounting of semiconductor packages onto substrates hasmainly been performed by the following two methods.

A first method involves image recognition of a lead location using acamera above the semiconductor package and verifying the orientation ofthe semiconductor package, after which the semiconductor package ismounted on the substrate and reflowed.

A second method involves image recognition of a lead position using acamera below the semiconductor package, after which the semiconductorpackage is mounted on the substrate and, after the orientation of thesemiconductor package is verified by a camera above the mountedsemiconductor package, it is reflowed.

In both cases, when verifying the orientation of the semiconductorpackage, it is determined whether the orientation is correct or not byimage recognition of the shapes of chamfered corners of thesemiconductor package. To be specific, as shown in FIG. 13, each of thecorners of a semiconductor package 1 is chamfered, and the chamferdimensions of one corner are made different from those of the othercorners. It is determined whether the orientation of the semiconductorpackage is correct or not by image recognition of the location of thecorner whose chamfer dimensions are different. When determining whetherit is correct or not, a specified threshold value is set so as todetermine whether there is a chamfer or not, and if it is determinedthat this threshold value is exceeded then the orientation is incorrect.

An example is proposed in Japanese Unexamined Patent Application, FirstPublication No. 2000-49446, wherein the direction of a semiconductorpackage is verified and then the semiconductor package is mounted on asubstrate, so that the mounting location accuracy is improved.

However, since corner chamfer shapes of semiconductor packages differdepending on the semiconductor package assembler, in a case of mountingsemiconductor packages manufactured by a plurality of assemblers, thereis an inconvenience in that the image processing threshold value forimage processing must be set for each assembler corresponding to thedifference and dispersion of the chamfer dimension settings.

Furthermore, since the invention proposed in Japanese Unexamined PatentApplication, First Publication No. 2000-49446 involves marking thesubstrate mounting side, and the location of a semiconductor package isdetermined by this marking, the direction of the semiconductor packagecan only be verified after mounting. Therefore, it is not possible todetermine whether the direction of the package is correct or not byverifying the direction of the semiconductor package before mounting.

Furthermore, the prior art does not have a mechanism for recognizing thedirection of a semiconductor package and rotating it to the correctdirection. Therefore, there is a problem in that a semiconductor packageplaced in a tray or the like in an incorrect direction remains in theincorrect direction when mounting.

BRIEF SUMMARY OF THE INVENTION

The present invention takes such matters into consideration, with anobject of providing a semiconductor package mounting method withexcellent work efficiency, by verifying the orientation of asemiconductor package by a simple method and orientating it correctlybefore mounting it onto a substrate, and providing a semiconductorpackage to use for this mounting method.

In order to solve the above problems, a first aspect of the presentinvention is a semiconductor package on which there is provided anidentification device for determining the orientation when thesemiconductor package is mounted onto a substrate.

A second aspect of the present invention is that in the first aspect,the identification device comprises a square shaped display sectionprovided on the surface of the package with at least one corner formeddifferently from the shapes of the other corners.

A third aspect of the present invention is that in the first and secondaspect, the identification device is a label provided on the surface ofthe package.

A fourth aspect of the present invention is a semiconductor packagemounting method comprising steps of; image recognition of a leadlocation of a semiconductor package, placing the semiconductor packageon a substrate, image recognition of the orientation of thesemiconductor package, and mounting the semiconductor package onto thesubstrate, wherein the step for image recognition of the orientation ofthe semiconductor package comprises a step for determining whether theorientation of the semiconductor package is correct by recognizing anidentification device provided on the semiconductor package.

A fifth aspect of the present invention is that in the fourth aspect ofthe semiconductor package mounting method, recognition of theidentification device provided on the semiconductor package is performedby dividing the surface of the semiconductor package into regions, thenimage recognition determines in which region the identification deviceis located, and the semiconductor package is rotated by an appropriateangle, depending on the location of the identification device, toorientate it correctly.

A sixth aspect of the present invention is that in the fourth aspect ofthe semiconductor package mounting method, recognition of theidentification device provided on the semiconductor package is performedby image recognition of a certain region on the surface of thesemiconductor package, then image recognition determines whether theidentification device is in this region, and the semiconductor packageis rotated as required, depending on whether the identification deviceis recognized or not, to orientate it correctly.

A seventh aspect of the present invention is a semiconductor packagemounting method comprising steps of recognizing a lead location of asemiconductor package by laser beam, placing the semiconductor packageon a substrate, recognizing the orientation of the semiconductor packageby laser beam, and mounting the semiconductor package on the substrate,wherein the step for recognizing the orientation of the semiconductorpackage by laser beam comprises a step for determining whether theorientation of the semiconductor package is correct by scanning thesurface of the semiconductor package by laser beam, and recognizing thelocation of an identification device provided on the semiconductorpackage by a reflectance pattern of reflected light or a change patternof reflected light.

According to the present invention, it is possible to provide asemiconductor package for which the orientation of the semiconductorpackage can be easily verified when mounting the semiconductor packageon a substrate, by chamfering one corner of a display section providedon the surface of the semiconductor package body by identical chamferdimensions, or by attaching a label on the semiconductor package body ata predetermined location, even if the semiconductor package is made by adifferent assembler.

Furthermore, according to the present invention, it is possible toprovide a semiconductor package mounting method, by which asemiconductor package can be orientated correctly on a substrate formounting easily and accurately, by chamfering one corner of a displaysection provided on the surface of the semiconductor package byidentical chamfer dimensions, or by image recognition of thesemiconductor package on which a label is attached on the semiconductorpackage body at a predetermined location.

Moreover, according to the present invention, it is possible to providea semiconductor package mounting method, by which a semiconductorpackage can be orientated correctly on a substrate for mounting easilyand accurately, by chamfering one corner of a display section providedon the surface of the semiconductor package by identical chamferdimensions, or by scanning the semiconductor package on which a label isattached on the semiconductor package body at a predetermined location,and recognizing the location of the identification device provided onthe semiconductor package by the reflectance pattern of reflectionlight.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A and FIG. 1B are top views of a first example of a semiconductorpackage of the present invention.

FIG. 2 is a top view of a second example of a semiconductor package ofthe present invention.

FIG. 3 is a diagram showing an example of a semiconductor packagemounting method of the present invention.

FIG. 4 is a diagram showing a method of determining whether theorientation of a semiconductor package is correct or not.

FIG. 5A and FIG. 5B are diagrams showing an example of a method ofdetermining the orientation of a semiconductor package.

FIG. 6A and FIG. 6B are diagrams showing another example of a method ofdetermining the orientation of a semiconductor package.

FIG. 7A and FIG. 7B are diagrams showing a method of orientating asemiconductor package correctly by scanning with a laser beam.

FIG. 8A and FIG. 8B are diagrams showing a method of orientating asemiconductor package correctly by scanning with a laser beam.

FIG. 9A and FIG. 9B are diagrams showing a method of orientating asemiconductor package correctly by scanning with a laser beam.

FIG. 10A, FIG. 10B and FIG. 10C are diagrams showing a method oforientating a semiconductor package correctly by scanning with a laserbeam.

FIG. 11 is a diagram showing an example of the positions of incidentlight and detectors when scanning with a laser beam.

FIG. 12A and FIG. 12B are diagrams showing a method of orientating asemiconductor package correctly by scanning with a laser beam.

FIG. 13 is a diagram showing an example of a conventional semiconductorpackage.

DETAILED DESCRIPTION OF THE INVENTION

As follows is a detailed description of the present invention.

Firstly, examples of a semiconductor package of the present inventionwill be described.

FIG. 1A and FIG. 1B are top views of a first example of a semiconductorpackage of the present invention.

In FIG. 1A and FIG. 1B, numeral 1 denotes the semiconductor package,numeral 2 denotes the semiconductor package body, and numeral 3 denotesa lead. One corner 2 a of the semiconductor package body 2 is chamferedsuch that its chamfer dimensions are different from those of the othercorners.

Since the semiconductor packages 1 shown in FIG. 1A and FIG. 1B are madeby different assemblers, the chamfer dimensions of the corners 2 a ofthe semiconductor package bodies 2 are different from each other.

Numeral 4 denotes a display section provided on the surface of thesemiconductor package body 2. This display section is square shaped andfollows the shape of the flat upper surface of the package body. Acorner 4 a, being one corner of this display section 4, is chamfered.This display section, or at least the chamfer dimensions of the displaysection, is made by a different assembler, and is made to be identicaleven if the semiconductor package has different chamfer dimensions. Thechamfer dimensions referred to here mean measurements such as the lengthof the side, the angles and the like of the chamfered part of thedisplay section.

In this manner, during image recognition of the display section 4 of thesemiconductor package 1 in this example, the chamfered section isidentified, the orientation of the semiconductor package 1 verified, andsince one corner of the display section 4 on the semiconductor package 1is chamfered by identical chamfer dimensions, the same threshold valuecan be used without setting a different image processing threshold valuefor image processing for each assembler.

In accordance with this example, it is possible to provide asemiconductor package such that the orientation of the semiconductorpackage can be verified easily when mounting the semiconductor packageonto a substrate, by chamfering one corner of a display section 4provided on the surface of the semiconductor package body 2 by identicalchamfer dimensions, even if the semiconductor package is made by adifferent assembler.

Next is a description of a second example of a semiconductor package ofthe present invention.

FIG. 2 is a top view of the second example of a semiconductor package ofthe present invention.

Numeral 5 denotes a label provided in the vicinity of one corner 2 a ofthe semiconductor package body 2, which is provided in order to verifythe orientation of the semiconductor package when mounting thesemiconductor package onto the substrate. This label 5 is attached byink or laser radiation.

For the shape of the label 5, FIG. 2 shows a circle, a triangle, asquare and an arrow. However, it is not limited to these. Anyrecognizable graphic shape may be used.

In accordance with this example, it is possible to provide asemiconductor package such that the orientation of the semiconductorpackage can be verified easily when mounting the semiconductor packageonto a substrate, by providing a label 5 on the semiconductor packagebody 2 at a predetermined location, even if the semiconductor package ismade by a different assembler.

In the above description, as a device for identifying the orientation ofthe semiconductor package 1, a device for chamfering one corner of asquare shaped display section 4 provided on the surface of thesemiconductor package body 2 by identical chamfer dimensions, and adevice for attaching a label 5 on the semiconductor package body 2 at apredetermined location are used. However, one part of the displaysection may have a different shape from the other parts in onedirection, and does not need to be a square shape. Furthermore, thedisplay may be a combination of the above devices.

Here, in the present invention, the kind of semiconductor package 1 isnot limited. It is applicable to all semiconductor packages such as QFP(Quad Flat Package), QFN (Quad Flat Non-leaded package), CSP (Chip SizePackage) and the like.

Next is a description of an example of a semiconductor package mountingmethod of the present invention.

FIG. 3 shows an example of a semiconductor package mounting method ofthe present invention.

When placing a semiconductor package 1 on a substrate 10, after theposition of a lead 3 is verified and adjusted by image recognition usinga camera 11 from above the semiconductor package 1, the semiconductorpackage 1 is placed on the substrate 10.

Next, the camera 11 performs image recognition of the top face of thesemiconductor package body 2. As shown in FIG. 1A and FIG. 1B, in thecase of a semiconductor package 1 in which a corner 4 a, being onecorner of a display section 4, is chamfered by identical chamferdimension, this chamfered section is recognized. Furthermore, as shownin FIG. 2, in the case of a semiconductor package 1 in which a label 5is provided on the semiconductor package body 2 at a predeterminedlocation, the location of the label 5 is recognized.

As a result, if the chamfered section of this corner 4 a or the positionof the label 5 is recognized correctly, it is determined that theorientation of the semiconductor package 1 is correct. On the otherhand, if the chamfered section of the corner 4 a or the label 5 is notrecognized correctly, it is determined that the orientation of thesemiconductor package 1 is not correct, and the orientation of thesemiconductor package 1 is adjusted until it is determined to becorrect.

As follows is a specific description of a method of determining thecorrectness of the orientation of the semiconductor package 1.

Here, a case wherein a characteristic label shown as one of the examplesin FIG. 2 is attached at a corner of the display section 4 will bedescribed. However, the case where a chamfered section is attached tothe display section 4 is the same.

FIG. 4 is a flow chart showing a method of determining the correctnessof the orientation of the semiconductor package 1.

Firstly, image recognition of the label attached at one corner of thedisplay section 4 is performed. For this image recognition, imagerecognition data of an image of a semiconductor package 1 located in thecorrect position is converted into digital signals and stored inadvance. Then, an image of the semiconductor package 1, being ameasurement object, is converted into digital signals to obtain imagerecognition data.

Here, an image is taken from a CCD camera or the like, and outlineenhancement and contrast enhancement are performed on this image to makeit easy to compare the recognized image pattern with the other imagepattern. With such contrast enhancement, since the semiconductor package1 is normally dark brown, the recognized image pattern becomes pureblack, so that it is easy to distinguish it from the printed characterpattern. Furthermore, with outline enhancement, even in a case whererecognition is difficult because of blurred shape, dirt, dust or thelike, it is possible to extract only the outline characteristics.Therefore, it is possible to improve the error prevention rate.

Next, based on the abovementioned image recognition data, thecorrectness of the orientation of the semiconductor package 1 isdetermined. That is, it is determined whether the image recognition dataof a semiconductor package 1 in the correct position and the imagerecognition data of the semiconductor package 1, being the measurementobject, are identical or not. As a result of this determination, if theimage recognition data are identical, the orientation is correct, so thesemiconductor package 1 is suction held and mounted onto the substrate10. On the other hand, if the orientation is not appropriate, thesemiconductor package 1 is rotated in an appropriate direction aftersuction holding, and is then mounted onto the substrate 10.

Another method of determining correctness of the orientation of thesemiconductor package 1 will be described in FIG. 5A and FIG. 5B.

In FIG. 5A, an image recognition region of a semiconductor package body2 is divided into four regions: region A, region B, region C and regionD. Here, the orientation is correct when a label 5 is in region A.

FIG. 5B is a flow chart showing an example of a method of determiningthe orientation of the semiconductor package 1. Firstly, imagerecognition of region A is performed. If the label 5 is recognized inthis image recognition of region A, the semiconductor package 1 isdetermined to be in the correct direction. If the label 5 is notrecognized, image recognition of region B is performed, and if the label5 is recognized, the semiconductor package 1 is suction held and thenrotated clockwise by 90°. If the label 5 is not recognized, imagerecognition of region C is performed.

If the label 5 is recognized in this image recognition of region C, thesemiconductor package 1 is suction held and then rotated clockwise by180°. If the label 5 is not recognized, image recognition of region D isperformed, and if the label 5 is recognized, the semiconductor package 1is suction held and then rotated clockwise by 270°. If the label 5 isnot recognized, an error message is issued.

Here, in the above description, image recognition of the four regions,region A, region B, region C and region D, is performed sequentially.However, a method may be used in which image recognition of the whole ofregion A, region B, region C and region D is performed simultaneously,and this recognition pattern is compared with a recognition patternstored and registered when the semiconductor package 1 is in the correctorientation.

Another method for determining the suitability of the orientation of thesemiconductor package 1 will be described in FIG. 6A and FIG. 6B.

In this example, the semiconductor package 1 is placed on anintermediate table capable of rotating, and the semiconductor package 1is rotated as required at each image recognition to orientate itcorrectly.

FIG. 6A shows image recognition by a CCD camera of a region in thevicinity of one corner 2 a of a semiconductor package body 2. Here, acase is shown where, since the semiconductor package 1 is in the correctorientation, image recognition of a label 5 attached on thesemiconductor package body 2 is performed by the CCD camera.

FIG. 6B is a flow chart showing a method of determining the orientationof the semiconductor package 1 in this example. After the semiconductorpackage 1 is transferred onto the intermediate table, image recognitionof a specified region of the semiconductor package body 2 is performedby the CCD camera. If the label 5 is recognized in this imagerecognition, the semiconductor package 1 is determined to be in thecorrect direction, and it is suction held and then mounted onto thesubstrate.

If the label 5 is not recognized, the semiconductor package 1 is rotatedby 90° and then image recognition is performed. If the label 5 isrecognized in this image recognition, the semiconductor package 1 isdetermined to be in the correct direction, and is suction held and thenmounted onto the substrate. If the label 5 is not recognized, thesemiconductor package 1 is rotated by a further 90° and then imagerecognition is performed. If the label 5 is recognized in this imagerecognition, it is determined that the semiconductor package 1 is in thecorrect direction, and after suction holding it is mounted onto thesubstrate. If the label 5 is not recognized, the semiconductor package 1is rotated by a further 90° and then image recognition is performed. Ifthe label 5 is recognized in this image recognition, the semiconductorpackage 1 is determined to be in the correct direction, after suctionholding it is mounted onto the substrate. If the label 5 is notrecognized, an error message is issued.

Furthermore, for a method of correcting the orientation of asemiconductor package 1, instead of image recognition as describedabove, it is also possible to correct the orientation of thesemiconductor package 1 by scanning the surface of the semiconductorpackage body 2 by a laser beam and measuring the reflected light. Asfollows is a description of a specific example.

FIG. 7A, FIG. 7B, FIG. 8A and FIG. 8B show a method of correcting theorientation of a semiconductor package 1 by scanning by laser beam. FIG.7A shows scanning of the semiconductor package body 2 progressively fromone end as shown by a broken line in the figure, and FIG. 7B illustratesthe reflectance of the laser beam reflected from the surface of thesemiconductor package body 2 with scanning time on the horizontal axis.Here, as shown in FIG. 7A, the label 5 is painted white or the like sothat its light reflectance is different from the other parts of thepackage body 2, which are black.

As shown in FIG. 7B, since the reflectance dips when a laser beamstrikes the label 5, it is possible to detect the location of the label5 attached to the semiconductor package body 2 from the relationshipbetween scan time t₁ until reaching the point at which the reflectancedips and scan time t₂ after passing the point at which the reflectancedips. Based on this detected location of the label 5, the semiconductorpackage 1 is rotated by the required angle to orientate it correctly.

FIG. 8A shows a case where the semiconductor package 1 is placed on anintermediate table capable of rotating, and the semiconductor package 1is scanned by laser beam during successive 90° rotations. In this case,the laser beam scans linearly as shown in FIG. 8A.

FIG. 8B illustrates the reflectance of laser beam reflected from thesurface of the semiconductor package body 2 for each 90° rotation in thecase of scanning by laser beam as in FIG. 8A. By using such a method, itis possible to detect the direction in which the semiconductor package 1is orientated from the rotation time at which the reflectance dips, andit is possible to orientate the semiconductor package 1 correctly basedon this information. FIG. 8A and FIG. 8B show a case where it isconfirmed that because the point at which the reflectance dips isdetected during the first rotation, this semiconductor package 1 isorientated correctly.

FIG. 9A and FIG. 9B show another example of a method of correcting theorientation of the semiconductor package 1 by scanning by laser beam.

In this example, as shown in FIG. 9A, a label 5, which is painted whiteor the like in order to improve light reflectance, is provided on thesurface of the semiconductor package body 2, and a mark such as a logois displayed on this label 5 by being left in black. Furthermore, acutout is provided at one corner of the label 5, and when this cutout islocated as shown in FIG. 9A, the semiconductor package 1 is orientatedcorrectly.

By forming the label 5 in this manner, when the surface of thesemiconductor package body 2 is scanned by laser beam, the reflectancepattern of reflected light changes depending on the scan position. FIG.9B shows the change of reflectance of the laser beam depending on thescan position when scanning by laser beam.

For example, in the case of scan 1, the time from when the scan isstarted until the laser beam reaches the label 5 is short. However, inthe case of scan 2, since the laser beam passes through the cutout ofthe label 5, the time until the laser beam reaches the label 5 is long.Since the reflectance of reflected light is low when the laser beampasses through the black part of the label 5, the peak width of thereflected light is narrow in scan 1, and the peak width of the reflectedlight is wide in scan 2. In this manner, the peak width of reflectedlight differs depending on the scan position.

In the case where the orientation of the semiconductor package 1 is notcorrect, since the cutout part of the label 5 is not in the positionshown in FIG. 9A, the peak width of the reflected light is not as shownin FIG. 9B. As a result, it is possible to determine the correctness ofthe orientation of the semiconductor package 1, and it is possible tocorrect the orientation of the semiconductor package 1.

In the above, for a method of correcting the orientation of asemiconductor package 1, a case wherein laser beam scanning is performedby attaching a label or the like on the surface of the semiconductorpackage body 2 is described. However, any other method, whereincorrection of the orientation is performed based on a change ofreflectance of laser beam, may be used. As an example, a method will bedescribed in which a difference in level is provided on the surface ofthe semiconductor package body 2 to see a change of the reflectancepattern.

In FIG. 10A a difference in level part provided on a part of the surfaceof a semiconductor package body 2 is shown, and FIG. 10B shows a crosssection A—A′ and a cross section B—B′ of this semiconductor package body2.

Laser beam scanning is performed of the semiconductor package on which adifference in level is provided in this manner. Reflected lightintensity is measured using a detector that can receive the laser beamreflected from the surface of the semiconductor package body 2 through apolarizing screen. This reflected light has no phase instability at theupper part of the level difference and the lower part of the leveldifference, but has phase instability at the boundary part.

FIG. 10C shows the appearance of this reflected light. Since the scanpositions are different between scan 1 and scan 2, it is possible torecognize the orientation by the difference between peak widths (A) and(B) of the reflected light as shown in FIG. 10C.

FIG. 11 shows a case where a laser beam is radiated obliquely toward thesurface of the semiconductor package body 2 and the reflected light isreceived from the surface of the semiconductor package body 2 by adetector.

In FIG. 11, an incident light a₀ is radiated from a direction at anangle θ to the surface of the semiconductor package body 2, a detectoris mounted obliquely and the position of this detector is moved througha₁, a₂, . . . a_(n). The intensity of the reflected light where thelevel of the surface of the semiconductor package body 2 changes isdifferent compared with the intensity of the reflected light at theother places. As a result, it is possible to identify the position ofthe surface level difference.

Furthermore, it is also possible to measure the height using the phasedifference of reflected light from the section where the level of thesurface of the semiconductor package 2 changes. In this case, the heightis measured by counting the number of moiré fringes caused by the phasedifference of the reflected light.

Next is a description of a method of justifying the orientation of asemiconductor package 1 by the location of the No. 1 pin mark providedon the semiconductor package body 2.

FIG. 12A shows a No. 1 pin mark provided on the surface of thesemiconductor package body 2, and FIG. 12B shows its side view. As shownin FIG. 12A and FIG. 12B, the size of the No. 1 pin mark normallydiffers between manufacturers. Here, the No. 1 pin mark of company B islarger than the No. 1 pin mark of company A.

In this manner, even if the size of the No. 1 pin mark provided on asemiconductor package 1 differs, by measuring the light reflected byscanning with a laser beam, the level difference of the No. 1 pin markis detected, and the location of the No. 1 pin mark can be recognized,so that it is possible to orientate the semiconductor package 1correctly based on this information. Here, when scanning by laser beam,by radiating at an angle from the vertical onto the surface of thesemiconductor package body 2, it is possible to distinguish thedifference of signal level more accurately.

By a method as above, when the semiconductor package 1 is orientatedcorrectly on the substrate 10, the semiconductor package 1 is mountedonto the substrate 10, after which the mounting of the semiconductorpackage 1 onto the substrate 10 is completed via a reflow step.

According to this example, by image recognition of a semiconductorpackage 1, where one corner of a display section 4 provided on thesurface of a semiconductor package body 2 is chamfered by identicalchamfer dimensions, or a label 5 is attached on the semiconductorpackage body 2 at a predetermined location, it is possible to provide asemiconductor package mounting method that can mount the semiconductorpackage 1 on a substrate 10 in the correct orientation easily andaccurately.

Furthermore, by scanning the semiconductor package 1 by laser beam,where one corner of a display section 4 provided on the surface of asemiconductor package body 2 is chamfered by identical chamferdimensions, or a label 5 is attached on the semiconductor package body 2at a predetermined location, and by recognizing the location of theidentification device provided on the semiconductor package 1 by thereflectance pattern of reflected light, it is possible to provide asemiconductor package mounting method that can mount the semiconductorpackage 1 on the substrate 10 in the correct orientation easily andaccurately.

1. A method for mounting a semiconductor package comprising: performingimage recognition of a lead location of said semiconductor package;placing said semiconductor package on a substrate; performing imagerecognition of the orientation of said semiconductor package; whereinthe step of image recognition of the orientation of said semiconductorpackage comprises a step for determining whether the orientation of saidsemiconductor package is correct by recognizing an identification meansprovided on said semiconductor package; and mounting said semiconductoronto said substrate.
 2. The method for mounting a semiconductor packageaccording to claim 1, wherein recognition of the identification meansprovided on said semiconductor package is performed by dividing a topsurface of said semiconductor package into regions, then determining inwhich region said identification means is located by image recognition,and said semiconductor package is rotated by an appropriate angle,depending on the location of said identification means, to orient itcorrectly.
 3. The method for mounting a semiconductor package accordingto claim 1, wherein recognition of the identification means provided onsaid semiconductor package is performed by image recognition of acertain region on a top surface of said semiconductor package, thenimage recognition determines whether said identification means is inthis region, and the semiconductor package is rotated as required,depending on whether said identification means is recognized or not, toorient it correctly.
 4. A method for mounting a semiconductor packagecomprising: recognizing a lead location of said semiconductor package bylaser beam; placing said semiconductor package on a substrate; andrecognizing the on orientation of said semiconductor package on saidsubstrate, wherein the step for recognizing the orientation of saidsemiconductor package by laser beam further comprises: determiningwhether the orientation of said semiconductor package is correct byscanning a top surface of said semiconductor package by laser beam, andrecognizing the location of an identification means provided on saidsemiconductor package by a reflectance pattern of reflected light or achange pattern of reflected light.
 5. The semiconductor package mountingmethod according to claim 4, further comprising: after the step ofidentifying the orientation of said semiconductor package by a laserbeam, rotating the semiconductor package by a required angle, dependingon the identified location of said identification means, to orient thesemiconductor package correctly.